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Two component high temperature thermal epoxy molding compound for electronic encapsulation potting

1000-9999 Kiloamperes
>=10000 Kiloamperes
Min. Order
1000 Kiloamperes
Choose your specifications
Company Information

Shanghai Sepna Chemical Technology Co., Ltd.

CN Manufacturer, Trading Company
Response Time
Response Rate:
US$ 90+
1 Year Paid Supplier Supplier Trade Assurance
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Quick Details

CAS No.: 67763-03-05
Other Names: epoxy resin
MF: mSiO2 nH2O
EINECS No.: 231-545-4
Place of Origin: China
Classification: Double Components Adhesives
Main Raw Material: Silicone
Usage: Construction,Fiber &amp; Garment,Footwear &amp; Leather,Packing,Transportation,Woodworking,electronic
Brand Name: SEPNA
Type: potting compound
Product name: thermal epoxy molding compound for electronic encapsulation potting
Keywords: potting compound
Color: Black
Application: Electronics
Quality: Excellent
Mixing ratio: A:B=5:1
Shelf life: 12 Months
Delivery time: Within 10-15 days
OEM: Acceptaple
Certificate: ISO9001
Selling Units: Single item
Single package size: 25X25X30 cm
Single gross weight: 25 KG
Package Type: A=B=20KG/Barrel
Product Description

Two component high temperature thermal epoxy molding compound for electronic encapsulation potting

SE2213 is two-component solvent-free room temperature curing epoxy potting material with high thermal conductivity 1.3W/mK and high temperature resistance.

Key Features

1.Excellent adhesion, anti-cracking property
2.Low CTE coefficient of linear expansion
3.Excellent electrical insulating properties, and stability
4.High thermal conductivity, low expansion coefficient
5.Can be used between temperature 150~180°C long-term

6.Good waterproof, moisture resistance, very low water absorption.


For encapsulation of electric products which require high thermal conductivity and heat resistance, such as motors, electric reactor, electric tools, instrumentation, automotive electronics etc. High temperature epoxy resin for electronics

Technical data sheet
VALUE of SE2213
Visual inspection
Black fluid
Transparent liquid
25°C, cps
25°C, g/cm3
Mixture ratio
Mass ratio
Viscosity of mixture
25°C, cps
Density of Mixture
25°C, g/cm3
Operation time
25°C, min
Preliminary Cured
60°C, min
Shore D
Thermal conductivity
Expansion coefficient
μm/(m, °C)
Glass transition temperature
Shear strength
MPa, Fe/Fe ; MPa, Al/Al
MPa, Al/Al
1.2MHz, 25°C
Dielectric strength
kV/mm, 25°C
Loss factor
Dielectric constant
1MHz, 25°C
Volume resistance
DC500V, ohm-cm
1.00E +15
Application temperature
Detailed Images

Directions for Use of High temperature epoxy resin for electronics

1.Stirring A component evenly before taking use.
2.Mix A, B two components with 100:8 mass ratio, stir well and do vacuum defoaming before potting to components.
3.It's a normal phenomenon of crystallization or agglomeration during the storage of part B, should thaw it by putting it into an 80 °C oven. (To avoid gas expansion and destroy container, the container should be opened.) And then cooled to room temperature to use, this does not affect its performance.
4.If necessary, continue to vacuum defoaming for components which been potted, help to increase the electrical performance of the device.
5.Curing conditions: 25°C/ 24 hours; 80°C/ 3 hours; 100°C/ 2 hours.

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Two component waterproof IP68 liquid silicone gel for electronics 

Two parts polyurethane resin potting compound for cable jont protection

RTV silicone adhesive sealant for electronics bonding and sealing

Thermal conductive silicone grease and lubricating silicone grease

Waterproof silicone waterproof conformal coating for PCB board

R&D Solution for electronics

Our products include RTV silicone adhesive sealant, two component silicone sealant, thermal conductive silicone potting material, thermal conductive silicone grease, lubricating silicone grease, silicone waterproof coating. Two parts liquid epoxy resin and hardener potiing material. Epoxy structure adhesive for metal/SMC bonding. Two parts polyurethane resin cable joint and other electronics application.

We have professional research and development team. We offer profession solution for customers. Please tell me your detail requirements, we will recommend you the most suitable products for you. We also can research a new product according to your requirements and applicaion.

Our Company

Shanghai Sepna Chemical Co.,Ltd is a professional industry adhesive supplier ,manufacturing polyurethane/silicone/epoxy sealant and adhesive,has nearly 16 years history. In 2005 Sepna introduced PUNADE technology from Switzerland.

Application Field :Electronics, Industry, Aviation, Automobile, Ship,Building,Rail vehicles, Power, Medical, LED, Semiconductor, New energy,etc.

You are welcome to do OEM and ODM.

Packing & Delivery
Our Service

1. OEM Manufacturing welcome: Product, Package...
2. Sample order
3. We will reply you for your inquiry in 24 hours.
4. after sending, we will track the products for you once every two days, until you get the products. When you got the goods, test them, and give me a feedback.If you have any questions about the problem, contact with us, we will offer the solve way for you.
5.We have different grade quality to meet your request, different usage.


1.Q:Delivery time ?
A: Normally,delivery time of sample order is 7 to 10 days, standard order is 15-20 days.

2.Q:How to get samples ?
A: Normally,Sepna offer our customer 1-2pcs or 100-500g free samples for quality testing.

3.Q:How to be Sepna's distributor ?
A: As the growing of Sepna's global business,we need to find more and more distributors and agents

worldwide.Sepna will provide the best solution and service for our partners.
For more information,pls contact our salesperson or call us:+86-400-882-1323

4.Q:Any OEM service ?
A: Yes. Sepna can offer the customer OEM label service,and will give the protection of the your right in your market.

5.Q:Do you have MOQ ?
A:Yes.Normally,MOQ is 2000pcs or 1000kgs.