|Payment Terms:||L/C,T/T,Western Union|
|Supply Ability:||10000000 Piece/Pieces per Month|
|Place of Origin:||Henan China|
|Keyword:||Thermoelectric Cooler Peltier|
|Condition:||New(industrial Peltier Cooler)|
|Packaging Detail:||carton for peltier element|
Thermoelectric peltier module tec1-12715 size 40*40mm 12V 120w
|The rated voltage||DC12V|
|Encapsulation process||704 silicone rubber seal|
Principle of thermoelectric peltier module
Semiconductor refrigeration sheet also called thermoelectric peltier module, is a heat pump, is a heat transfer tool. When a pair of n-type semiconductor materials and a p-type semiconductor materials are connected, when there is a current passing through the two ends, there will be a heat transfer between the two ends, and the heat will be transferred from one end to the other end, thus creating a temperature difference to form a hot and cold end. However, there is resistance in the semiconductor itself. When the current passes through the semiconductor, it will generate heat, which will affect the heat transfer. Moreover, the heat between the two substrates will also conduct reverse heat transfer through the air and the semiconductor material itself. When the hot and cold ends reach a certain temperature difference and the two heat transfer amounts are equal, an equilibrium point will be reached and the positive and negative heat transfer cancel each other out. The temperature at the hot and cold ends will not continue to change. In order to achieve lower temperature, heat dissipation and other ways can be adopted to reduce the temperature of the hot end to achieve.
The role of fans and heat sinks is mainly to dissipate heat at the hot end of the cooling sheet. Generally, the temperature difference between the hot and cold ends of the semiconductor cooling sheet can reach 40-65 degrees Celsius.
When a piece of n-type semiconductor material and a piece of p-type semiconductor material are connected to form an electric couple, after the direct current is connected in this circuit, heat transfer can be generated. The connection from the p-type element to the n-type element releases heat and becomes the hot end. The magnitude of heat absorption and heat release is determined by the magnitude of the current and the logarithm of the N and P components of the semiconductor material.