High frequency microwave PTFE copper clad material with ceramic substrate for PCB board( (TF without Copper Foil)

$38.00 - $468.00
Min. Order
1 Piece
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Company Information

Taizhou Wangling Insulating Materials Factory

CN Manufacturer, Trading Company
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Response Rate:
40%
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US$ 100+
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Quick Details

Port: Shanghai,Taizhou
Payment Terms: L/C,T/T,Western Union
Supply Ability: 5000 Square Meter/Square Meters per Month Sample is free of charge, but should pay freight.
Place of Origin: Jiangsu China
Brand Name: WL
Model Number: TF(without copper foil)
Type: Insulation Sheet
Material: ceramic,PTFE
Application: -80~+260℃(Processing temperature should not exceed 200℃)
Rated Voltage: -
Tensile Strength: -
Product name: PTFE copper clad material with ceramic(TF without copper foil)
Dielectric constant( @10GHZ): 3.0/6.0/9.2/9.6/10.2/16.0/20.0/22.0
Size: 150X150mm, 250X250mm
Dielectric Layer: PTFE and Ceramics
Thermal conductivity(W/m/k): More than 0.5
Density(g/cm3): from 2.0 to 3.5
Moisture Absorption(%): Less than 0.05
Certification: SGS
Usage: PCB
Sample: Sample Avaliable
Packaging Detail: Cartons or wooden cases

Teflon ceramic composite dielectric subatrate

(TF without copper foil)

 

1.Description:

       TF-1/2 is a kind of circuit laminate based on the Teflon(which have excellent microwave and temperature resistance performance)compound with ceramic. This kind of laminate can be comparable with the products(such as RT/duroid 6006/6010/TMM10)from Rogers Corporation in United State of America.

    Advantage:

(1)The operating temperature is much higher than TP-series. It is applicable to long-term operation within temperature ranger of -80~+200and can be used for wave-soldering and reflow soldering.

(2)Used for the manufacturing of the microwave and millimeter wave printed circuit board .  

(3)Better radiation performance,30min20rad/cm2.

(4)Dielectric property is stable and has a slight variation with the rise of temperature and frequency. (εr=3.0;6.0;9.2;9.6;10.2;16;20;22)

 

 

Product code des

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 2.Specifications:

Types

Original side  (No copper foil on both sides)

Dimensions A×B(mm) and Tolerance(mm)

 

5.9''x5.9''(150×150mm), 9.8''x9.8''(250×250mm)

±2

Thickness and Tolerance(mm)

0.8±0.05,1.0±0.05,1.5±0.05,2.0±0.075,2.5±0.075

For special dimensions(≤2.5mm),customized lamination is available.

DK(εr)3.0,   6.0,   9.2,   9.6,   10.2,   16.0,   20.0,   22.0
DK can be customized.

Dissipation factor

(tgδ)

 

Test condition: 10GHZ

DK: 3-11

≤1×10-3

Test condition: 10GHZ

DK: 12-22

≤1.5×10-3

Surface Resistivity

(MΩ.cm )

Test condition: normal state(500V DC)

 ≥1×105

Volume Resistivity

(MΩ.cm )

Test condition: normal state

≥1×105

 

Coefficient of thermal expansion

(ppm/℃)

(Typical)

X  Axis

Y  Axis

Z  Axis

 

 

 

Condition: -55℃ to 288℃

<50

<50

<60

Workshop

initpintu__.jpg 3.jpg 3.Technical index:

 TF_

 

Applications

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