250k 0.76mm Lead free Solder Ball for BGA reballing station
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES.
Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours
Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips: 245℃-260℃(Maximun)
Leaded/Pb BGA chips:180℃-205℃(Maximun)
RT809H Programmer+55 Adapter
TV160 Mainboard tester
Superpro 610P Programmer
DHL/UPS/FedEx - 3~7 days
Aramex - 5~15 days
China Post/SG Post/HK Post - 15~60 days
*Shipping cost & Shipping time is different for each Courier company