1U LGA1150 1151 1155 1156 copper passive CPU cooler

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Shenzhen Innovision Technology Co., Ltd.8 yrs

CN

Key attributes

Industry-specific attributes

Type

Heatsink

Other attributes

Place of Origin

Guangdong, China

Heatsink Material

Copper

Application

Processor

Brand Name

IOVSTECH

Model Number

115x-1UF1

Dimension

88mm*88mm*24mm

MAX TDP

130W

Mounting pitch

75*75mm

Application

1U Server Passive Platform

CPU Socket

LGA 115X (Mounting pitch: 75*75mm)

Feature(1)

Copper Base & Copper Skvin Fins

Feature(2)

Cooper basement can absorb more thermal.

Feature(3)

High-density copper fin heat dissipation

Installation

Screw+ Spring

Weight

450G

Packaging and delivery

Selling Units:

Single item

Single package size:

13X13X13 cm

Single gross weight:

0.900 kg

Lead time

Quantity (pieces)	1 - 1000	> 1000
Lead time (days)	3	To be negotiated

Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 10000 piece

Sample price:

$16.50/piece

Customization

Customized logo

Min. order: 100

Customized packaging

Min. order: 100

Graphic customization

Min. order: 100

For more customization details, message supplier

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Shenzhen Innovision Technology Co., Ltd.

8 yrsLocated in CN

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Product descriptions from the supplier

1 - 99 pieces

$21.00

>= 100 pieces

$16.80

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable

Item subtotal (0 variations 0 items)

$0.00

Shipping total

$0.00

Subtotal

$0.00

Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 10000 piece

Sample price:

$16.50/piece

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