1.It can improve the mechanical strength of the reinforced glass fiber roving composite materials and has high strength retention rate under hygrometric state.
2.It can improve the adhesive force of resins, substrate and inorganic fillings, thus enhancing the electrical property of epoxy resin integrated electronic material and printed circuit board under hygrometric state.
3.It can improve the electrical property of various inorganic mineral filling composite materials under hygrometric state, such as nylon and PBT.
4.As surface treating agent for inorganic fillings, this product can be widely applied for pottery clay, talcum powder, wollastonite, white carbon black, quartz, aluminum powder, copper powder, iron powder, etc.
5.It can be used as the epoxy sealing agent for filling quartz, the epoxy concrete patching material or coating for filling sands and the epoxy mould material for filling metals.
6.It can improve the adhesive force of the bi-component epoxy sealing agent.
7.It can improve the adhesive force between acrylic latex, sealing agent and polyurethane and epoxy coating.