Two-part Thermally Conductive Silicone Encapsulant and Potting Compound for Military Electronics

$4.00 - $10.00
Min. Order
40 Kilograms
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Company Information

Shenzhen Anpin Silicone Material Co., Ltd.

CN Manufacturer
Response Time
<24h
Response Rate:
100%
Transactions
US$ 10,000+
1 Year Paid Supplier Gold Supplier Onsite Check Trade Assurance
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Quick Details

Port: Shenzhen or Hong Kong
Payment Terms: L/C,T/T,Western Union,To be agreed
Supply Ability: 1000 Metric Ton/Metric Tons per Month
CAS No.: N/A
Other Names: Thermally Conductive Encapsulant
MF: N/A
EINECS No.: N/A
Place of Origin: Guangdong China
Classification: Double Components Adhesives
Main Raw Material: Silicone
Usage: Electronics
Brand Name: ANPIN SILICONE
Model Number: 905 (G21)
Type: Silicone
Appearance: Flowable liquid
Mix Ratio: 1:1
Viscosity (Mixed): 1,700 cPs
Working Time at 25 deg C: 40 minutes
Cure time at 25 deg C: 8 hours
Hardness (Shore A): 55
Dielectric Strength: 10 kV/mm
Thermal Conductivity: 0.75 W/m-K
Delivery Detail: Within 7 days
Packaging Detail: 10 kg/plastic pail, 20 kg/set; 20 kg/pail, 40 kg/set

 

Product Description

Two-part; thermally conductive, room temperature or heat cure; minimal shrinkage; no exotherm during cure; no solvents or cure by-products; deep section cure; repairable; good dielectric properties; cures to a flexible elastomer

 

Two-part Thermally Conductive Silicone Encapsulant and Potting Compound for Electronics 905 is manactured by full-automatic producrtion line with capacity (1,000,000 kg/month). Plants locate in DAYAWAN, HUIZHOU, GUANGDONG, CHINA

 

Potential Uses

  • General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, relays
  • Adhesive/ encapsulant for solar cells
  • Optical applications requiring high refractive index encapsulating
  • Applications requiring high thermal conductivity and/or good primerless adhesion
Typical Specification

Property

Unit

Value

Before curing

Appearance

/

Grey (Part A)

White (Part B)

Viscosity

cps

1,800 (Part A)

1,600 (Part B)

Density

g/cm3

1.62 (Part A)

1.74 (Part B)

After mixing

Mixing ratio (Part A: Part B)

/

1:1

Mixing viscosity

cps

1,700

Operation time

min

40 Min

Curing time

h

8

After curing




 


Hardness

Share A

55

Dielectric strength

KV/mm

10

Volume resistivity

Ω•cm

1.0×1014 Min

Dielectric constant

60 Hz

3.0

Thermal conductivity

W/m-K

0.75

UL 94, RTI 150 deg C

V0

Yes

 

 

Cross References

Dow Corning Sylgard brand silicone encapsulants, CN 8760

Wacker SEMICOSIL970 TC A/B

  

3rd Certificates

ISO

RoHS

REACH

UL

TVU

  

Packaging & Shipping

Packaging: 10 kg/plastic pail, 20 kg/set or 20 kg/plastic pail, 40 kg/set with pallets or to be agreed

Shipping: 

Small quanlity: by air

Bulk quantity: by sea, by railway ro by sea

 

Our Services

As a reliable silicone encapsulant solution supplier with strong technical support

 

Company Information

 A 12-year electronic silicone encapsulant leading manufacturer in China

No. 1 quality thermally conductive silicone encapsulant in China

Senior sales representative Mr. James [JAMES(at)APSI(dot)CN]