AB Potting Compound Silicone EG-N100T for PCB

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Hunan LEED Electronic Ink Co., Ltd.11 yrs

CN

Key attributes

Industry-specific attributes

CAS No.

potting glue

Other attributes

Place of Origin

Hunan, China

Main Raw Material

Silicone

Usage

Packing, electronics

Other Names

silicone gel

MF

silicone

EINECS No.

chemicals

Classification

Double Components Adhesives

Brand Name

LEED-INK

Model Number

EG-N100T

Type

Liquid Glue

Color

Colorless, transparent

Mixing Ratio

A:B=1:1

Viscosity (mPa.S)

1,000

Density (g/cm 3 )

0.96

Thermal Conductivity (W/m.K)

0.2

Surface Drying Time(h)

2.5

Curing Time (h)

25℃/24h, or 90℃/1.2h

Volume Resistance (Ω.cm)

1*10 14

Breakdown Voltage(kV/mm)

11

Thixotropic Index(0.1mm)

381

Packaging and delivery

Packaging Details

Silicone gel standard package1KG/Plastic jar, 5KGS/Plastic bucket, and 25KGS/Plastic bucket applicable to sea freight or air freight from Zhuzhou, Hunan to the world.

Port

Any Port in China

Supply Ability

Supply Ability

3 Ton/Tons per Month chemicals

Know your supplier

Hunan LEED Electronic Ink Co., Ltd.

11 yrsLocated in CN

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Product descriptions from the supplier

Minimum order quantity: 1 kilogram

$31.00 - $45.00

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable

Item subtotal (0 variations 0 items)

$0.00

Shipping total

$0.00

Subtotal

$0.00

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