JRFT thermal conductivity encapsulants silicone pouring adhesive sealant (1:1)

$4.20 - $5.80
Min. Order
2 Kilograms
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Company Information

Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

CN Manufacturer, Trading Company
Response Time
<24h
Response Rate:
96%
Transactions
US$ 700+
5 Years Paid Supplier Gold Supplier Onsite Check Trade Assurance
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Quick Details

Port: shenzhen
Payment Terms: L/C,T/T,Western Union,MoneyGram,paypal
Supply Ability: 100000 Kilogram/Kilograms per Week
Other Names: Two-component silicone sealant
Place of Origin: Guangdong China
Classification: Other Adhesives
Main Raw Material: Silicone
Usage: LED light , electronic parts
Brand Name: JRFT
Model Number: 1:1
density: 1.85&plusmn;0.05
viscosity: 4500&plusmn;1500
mixing ration: 100 100
hardness: 55&plusmn;5
conductivity factor: 1.2
flame retardant: V 0
Delivery Detail: 3-5days
Packaging Detail: encapsulant are supplied in 50g(sample) 1kg and 20kg plastic bucket. The Part A and B are packaged in different plastics

 

Product Description

  Features

 

  • High thermal conductivity --provides the highest thermal conductivity with its viscosity range in the world.
  • Low Stress--exhibits low shrinkage and stress on components as it is curing;low thermal expansion after curing.
  • Highly reliable--composed of an addition-curing polydimethly siloxane polymer that will not deploymerize when heated in confined spaces.
  • Low Viscosity--maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.
  • Environmentally Resistant--provides excellent thermal shock resistance.
  • UL Rated--meets requirements of UL 94 V-O standard;provides excellent flame retardancy.

 Applications

IC potting 

LED light 

Electronic watches,

Calculators,

Computers,

LCD modules,

Semiconductor components and

COB bonding

 

 

physical properties

Viscosity ( at 25°c)

55000~90000cps

Appearance

Black paste

Thixotropy

1.5

Curing time (150 ° C)

40~60 mins 

Specific gravity

1.48  g/ml

Shelf 5 °C

6 months (cold storage)

Life (opened)

7 days 

properties after cure 

Shrinkage rate

<0.1%

Resistance to soldering heat,
430 °C solder solution

3 s

Water absorption

24 h,25 °C

 0.04%

24 h,100 °C

0.021%

Heat distortion temperature

160 °C   

Peak temperature

135 °C

Glass transition temperature

127 °C

Expansion coefficient ,100 °C,24h

 0.25%

Dielectric loss tangent,1HKZ

0.005

Impact strength

9~11  kg/cm/cm

Compressive strength

12~13  kg/mm2

Tensile strength

11~13  kg/mm2

Tensile strength(RM) 

13~15  kg/mm2

Extension rate

1.78%

Breakdown voltage 25 °C

20~23  KV / mm

Surface resistance 25 °C

2X1015  0hm/cm 

Volume resistance 25 °C

5X1010   0hm/cm

 

JRFT  thermal conductivity encapsulants silicone pouring adhesive sealant (1:1)

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