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Low Exothermic reaction epoxy potting compound
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Key attributes
Industry-specific attributes
CAS No.
25068-38-6
Other attributes
Place of Origin
Taiwan, China
Main Raw Material
Epoxy
Usage
Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking, Electrical and Electronic parts
Other Names
potting material for electronic components
MF
potting material for pcb
EINECS No.
two part epoxy resin
Classification
Double Components Adhesives
Brand Name
FONG YONG
Model Number
E-190B/H-190
Type
AB glue
Application
Electronic Components
Color
Black
Keywords
Epoxy Resin Liquid
Certificate
IATF 16949
Advantage
Low Heat
Component
Two Component AB Glue
OEM
Avalialbe
Performance
Excellent Dielectric Property
Delivery Time
5-7 Working Days
Curing time
3-24 hours
Packaging and delivery
Packaging Details
15kgs, 5kgs
Port
Keelung, Taiwan
Supply Ability
Supply Ability
100 Tonne/Tonnes per Month
Lead time
| Quantity (kilograms) | 1 - 100 | 101 - 1000 | 1001 - 5000 | > 5000 |
| Lead time (days) | 5 | 7 | 15 | To be negotiated |
Know your supplier
Product descriptions from the supplier
Minimum order quantity: 1 kilogram
$8.50 - $15.00Quantity
Shipping
Shipping solutions for the selected quantity are currently unavailableItem subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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