| Port: | Shenzhen |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
| Supply Ability: | 10000 Piece/Pieces per Month |
| Place of Origin: | Guangdong China |
| Solder Mask Colour: | solder mask matt green, silkscreen white |
| Copper Thickness: | 1/1oz |
| Min. Hole Size: | 0.1-6.5mm |
| Model Number: | KS412 |
| Min. Line Spacing: | 3mil |
| Min. Line Width: | 3mil |
| Brand Name: | Kingsun |
| Special Technology: | Blind&buried via, Via In Pad |
| Shaping: | CNC Routing,Punching,V-CUT |
| Board Size: | 122.94*114.3mm(20up) |
| Board Thickness: | 1.6mm |
| Base Material: | FR4 |
| Surface Finishing: | HASL - LF,ENIG,ENIG |
| Certificate: | ISO19001/SGS |
| Packaging Detail: | Vacuum-packed in a colorless air-ball plastic bag and the necessary desiccant should be attached to the bag and the bag is tightly packed |
| Package Preview: | https://sc04.alicdn.com/kf/H6c002884ce9f43399621c7066fb65ad55.jpg_640x640.jpg,https://sc04.alicdn.com/kf/He8747ef80c434218812df0562bc812fcW.png_640x640.png |
|
Item |
Specification |
|
Minimum Circuit Trace Width/Space |
2.7/12.7mil |
|
The Minimum ViaSize |
0.1mm |
|
The Minimum legend Height Width |
0.5mm/0.12mm |
|
Surface Finishing |
HASL-LF, ENIG, ENEPIG, OSP, Gold Finger, Hard Gold Plating, Immersion Silver, Immersion Tin |
|
Special Technology |
Blind&buried via, Via In Pad, Back drill, Small BGA Pad, lmpedance control, Heavy Copper, Copper Filled Via, Countersink hole, Depth Milling |
|
Material Type |
FR4, Metal Core, Halogen Free FR4, Rogers, PTFE, Arlon, Nelco, Polyimide |
|
Maximum Panel Dimension |
1200mmx600mm |
|
Final Board Thickness |
0.4mm~6.0mm |
|
Final Copper Thickness |
HOZ 10Z 20Z 30Z 40Z 60Z 10OZ |
|
FR4 Substrate Thickness |
0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm |
|
Solder Mask Colour |
Green, White, Black, Red, Blue, Yellow |
|
Shaping |
CNCRouting, Punching, V-CUT, Depth milling, Castellation |
|
Special Hole |
Blind&buried hole, Depth milling, T-slot, Countersink hole |
