$9.00
Min. Order : 1 Square Meter
$0.10
≥10 Square Meters

High Density SIM CARD package IC substrate

Quick Details

Port: shenzhen
Payment Terms: T/T,Western Union
Pattern: Tenting,MSAP,PSAP,ETS,SAP
Description: IC substrate
Place of Origin: China
Warranty: 1 year
SR material: Taiyo,Hitachi,Sumitomo,SanEI
Size: Customized
Core material: MGC,Doosan,LG,Hitachi,Sumitomo,AMC
Model Number: UO-21015A-A
MOQ: 20 strips
Brand Name: N/A
Brand: No brand
Soldermask: PSR series
Type: LOGIC ICS
Targrt products: PBGA,FBGA,FMC,SIP,MCP,FCCSP,POP,FCBGA,LGA,etc
D/C: 20200729
Surface Finish: E'tro-Ni/Au ENIG,ENEPIG OSP(AFOP) Hard Au
Package: IC package
Zhuhai Fillgold Technology Co., Ltd.
Supplier
CN
Manufacturer, Trading Company
≤5h
Response Time
100.0%
On-time delivery rate
-
-
Transactions
101-200
Employees
11-20
R&D staffs
0
Patents
Visit Store
Product Description
Product Name
UO-21015A-A
Targrt products
PBGA,FBGA,FMC,SIP,MCP,FCCSP,POP,FCBGA,LGA,etc
Core material
MGC,Doosan,LG,Hitachi,Panasonic,Sumitomo,AMC
SR material
Taiyo,Hitachi,Sumitomo,SanEI
Function
Integrated circuit package
Package
Vacuum package
  • Product  description

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally,
the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC
components. It is one of the most key materials of the IC packaging, and the share of IC substrate.

Process Capability
Our Technology
Fine pattern by MSAP(20/20um) and Tenting(30/30um) • Various Applicable Technical Option - Thin Core Technology - All type Surface Finish - SR Flatness Process, Build up / Via Filling Tech. - Tailless, Etch-back Process - Fine Pitch SOP process • High Quality and Reliability Substrate • High Speed Delivery : No need film, No outsourcing • Competitive Low Running Cost
W/B CSP Technology Roadmap
FCCSP Technology Roadmap
FPS(Fingerprint Sub.) Technology Roadmap


Option Technology
Tailless(EBS)
Etch-Back
Via-Tech
Dicing & Reel packing


Special Products
Single layer
Coreless ETS
Coreless 3L,4L,7L
FMC (SD-Card, SIM, UDP, etc.)
Fingerprint sub
OEM ODM
Want to know more,please contact us freely!
Packing&Shipping
Packaging Details
neutral packing /customed
Shipping
If you order small quantity,can use UPS,Fedex and DHL door to door
Port
shenzhen,Hong Kong
Lead time
QTY (PCS)
Lead Time
Samples
2weeks/negotiated
MP
3-4weeks/negotiated
Company Introduction
Zhuhai Fillgold Technology Co., Ltd. established in 2012, is a professional enterprise engaged in the research, development,sale and service of precision components for mobile communications; PCB heatsink; IC lead frame and IC Substrate,which widely applied to telecom, computer, industrial control, power, medical, automotive electronics and so on.Besides, we are making great efforts to develop new products to meet different requirements.We are located in Zhuhai city with convenient transportation access. Our company occupies an area of 3 0 0 0 0 square meters, is equipped with a variety of processes: stamping, precision grinding & polishing, CNC, chemical etching, plating and so on.Our tenet is multi-species, high quality, quick turn .Dedicated to strict quality control and thoughtful customer service, our experienced team is always available to discuss your requirements and ensure full customer satisfaction. In addition, we have obtained IATF 16949:2016; ISO9001:2015 and ISO14001:2015 certificates. Our products are selling well in all cities and provinces around China, and also exported to clients in such countries and regions as Europe. We also welcome other regions orders. Whether selecting a current product from our catalog or seeking engineering assistance for your application, Please talk to our customer service center about your sourcing requirements.
Certifications
Recommend Products
FAQ
Q: Do you have any products in stock?
A: Sorry, all of the products parts are customized design.
Q: What could be the procedure if I need to make the prototypes?
A:If you have drawings,such as Gerber,CAD.pls kindly send to us ,and tell us any your special requirements .
Q: How to keep our product information and design file secret ?
A: We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.